Aluminum substrate technology and production process

Aluminum substrate technology refers to the formulation of reasonable and feasible specifications for the processing and treatment of aluminum substrates based on the principles of technological advancement and economic rationality and the purpose of excellent quality of the final product. Its production process mainly includes the following steps:

First, an overview of aluminum substrate technology

Aluminum substrates have excellent heat dissipation, machinability, dimensional stability and electrical properties, and are widely used in hybrid integrated circuits, automobiles, office automation, high-power electrical equipment, power supply equipment and other fields. With the development of electronic technology, the production process of aluminum substrates is also being optimized to meet the production needs of higher quality and higher efficiency.

Second, aluminum substrate production process

Cutting

Process: incoming materials → cutting → baking.

Purpose: Cut large-sized incoming materials into the size required for production.

Precautions: After cutting, the edge of the board is sharp and needs to be ground with an edge grinder, pay attention to scratches on the aluminum surface and copper surface, avoid delamination and flashing of the board edge.

Drilling

Process: pinning → drilling → board inspection.

Purpose: Positioning and drilling holes in the board to provide assistance for subsequent production processes and customer assembly.

Notes: Check the number and size of the holes, avoid scratches on the sheet, check the flash and hole position deviation of the aluminum surface, check and replace the drill tip in time.

Dry film photo imaging

Process: grinding plate → film application → exposure → development.

Purpose: To present the part required for making the circuit on the sheet.

Notes: Check whether the circuit is open after development, pay attention to the poor circuit caused by scratches on the board surface, no air should remain during exposure to prevent poor exposure.

Etching

Process: etching → film removal → drying → board inspection.

Purpose: After imaging the dry film, keep the required circuit part and remove the excess part outside the circuit.

Notes: The concentration of NaOH solution needs to be controlled during etching to prevent oxidation of the board surface.

Green oil

Process: grinding plate (only brushing copper surface) → silk screen printing green oil (first time) → pre-baking → silk screen printing green oil (second time) → pre-baking → exposure → development → grinding machine pickling soft brush → post-curing → next process.

Purpose: To form a protective layer on the board surface to prevent the circuit from being oxidized or short-circuited.

Characters

Process: character printing.

Purpose: Print information such as logos and numbers on the board surface for easy identification and traceability.

Spraying tin

Process: Pre-treatment of spraying tin → spraying tin.

Purpose: Form a layer of tin on the board surface to improve welding performance and conductivity.

Precautions: Tear off the protective film before spraying tin, Hold the edge of the board with both hands, and it is strictly forbidden to touch the inside of the board directly with your hands, Pay attention to the operation and prevent scratches.

Aluminum base surface treatment

Process: Grind the board → Wash → Passivate → Wash → Blow dry → Dry.

Purpose: Protect the aluminum base surface to improve corrosion resistance and reliability.

Punching board

Process: Punch the board according to MI requirements.

Purpose: Punch the sheet into the required shape and size.

Final inspection

Process: Carry out various inspections according to IPC comprehensive enterprise standards, etc.

Purpose: Ensure that product quality meets standard requirements.

Packaging

Process: Classification packaging → Put moisture-proof beads → Label.

Purpose: Protect the product from damage and contamination, and facilitate storage and transportation.

Third, precautions

Aluminum substrate materials are expensive, and special attention should be paid to the standardization of operations during the production process to prevent scrapping due to non-standard operations.

Operators in each process must handle with care to avoid scratches on the board surface and the aluminum base surface.

Operators in each process should try to avoid touching the effective area of the aluminum substrate with their hands. When holding the board during tin spraying and subsequent processes, only the edge of the board is allowed. It is strictly forbidden to touch the board directly with fingers.

Through the above process, aluminum substrate products that meet quality requirements can be produced. With the continuous development of electronic technology, aluminum substrate technology will continue to be optimized and innovated to meet a wider range of application needs.