How to design lighting ring aluminum substrate to take into account good thermal conductivity?
Publish Time: 2025-01-16
Lighting ring aluminum substrate is very common in LED lighting applications. Its main function is to provide an efficient thermal conduction path to quickly conduct the heat generated by the LED to ensure the stability and life of the LED lamp. A well-designed lighting ring aluminum substrate needs to take into account thermal conductivity, mechanical strength, electrical insulation and cost-effectiveness.1. Material selectionThermal conduction layer: The thermal conduction layer in the middle of the aluminum substrate is a key component and is usually made of copper or aluminum. Copper has better thermal conductivity but higher cost; aluminum has slightly lower thermal conductivity but lower cost and is more suitable for large-scale applications.2. Structural designThermal conduction path optimization: Design a reasonable thermal conduction path so that heat can be quickly conducted from the LED chip to the heat sink. Common designs include planar structure and multi-layer structure. Multi-layer structure can increase the surface area of the thermal conduction path and improve thermal conduction efficiency.Heat diffusion plate: Add a heat diffusion plate to the aluminum substrate to help evenly disperse the heat. Heat diffusion plates are usually made of high thermal conductivity materials such as copper or aluminum.Heat pipe: In situations where higher thermal conductivity is required, heat pipes can be integrated on the aluminum substrate to quickly conduct heat using the heat pipe's efficient thermal conductivity.3. Surface treatmentSurface roughness: Optimizing the roughness of the aluminum substrate surface can increase its contact area with the heat sink, thereby enhancing thermal conductivity. Surface roughness can be achieved through mechanical processing, chemical treatment or spraying.Thermal interface material: Use high thermal conductivity interface materials (such as thermal grease and thermal pads) to fill the gap between the aluminum substrate and the heat sink to reduce thermal resistance and improve thermal conduction efficiency.4. Electrical insulationInsulation layer: Add a layer of highly insulating material, such as ceramics, epoxy resin, etc., between the thermal conductive layer and the circuit layer of the aluminum substrate to ensure the insulation and safety of the circuit.Insulation coating: Apply an insulating coating on the surface of the aluminum substrate to prevent electrical short circuits and leakage.5. Mechanical strength and reliabilityMechanical design: Ensure that the aluminum substrate has sufficient mechanical strength to withstand the mechanical stress during installation and transportation. Mechanical strength can be enhanced by increasing the thickness of the board and designing a reasonable support structure.Fatigue test: Fatigue test is performed to evaluate the stability and reliability of the aluminum substrate in long-term use. The test content includes thermal cycle test, mechanical vibration test, etc.6. Cost controlMaterial cost: Select materials that balance performance and cost, such as aluminum substrate and copper thermal conductive layer, to ensure that the cost is controlled while meeting the performance requirements.Manufacturing process: Optimize the manufacturing process, reduce the scrap rate and rework rate, and reduce production costs. Common manufacturing processes include stamping, die casting, CNC processing, etc.7. Heat dissipation designRadiator: Design an efficient radiator that matches the aluminum substrate, such as fins, heat sinks, cooling fans, etc., to ensure that heat can be quickly dissipated.Air duct design: Optimize the air duct design of the radiator and aluminum substrate to ensure smooth air circulation and improve heat dissipation efficiency.8. Testing and verificationThermal simulation: Use thermal simulation software to perform thermal performance analysis, optimize design parameters, and ensure the rationality of the heat conduction path.Actual test: Conduct actual tests to verify the thermal conductivity and reliability of the design. Test contents include temperature distribution test, thermal resistance test, etc.Through optimization in material selection, structural design, surface treatment, electrical insulation, mechanical strength and reliability, cost control, heat dissipation design, testing and verification, a lighting ring aluminum substrate with good thermal conductivity can be designed. These optimization measures can not only improve the heat dissipation efficiency of LED lamps and extend their service life, but also ensure the reliability and safety of the product to meet the needs of different application scenarios.
